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我們都知道3D-IC是邁向橋接異質整合的最後一哩路,但3D-IC 如何處理熱傳及熱應力的問題?🤔🤔<...

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我們都知道3D-IC是邁向橋接異質整合的最後一哩路,但3D-IC 如何處理熱傳及熱應力的問題?🤔🤔

為此,Cadence特別將舉行「以Celsius熱求解器解決3D-IC散熱與應力挑戰」中文線上研討會,將介紹Cadence Celsius 熱求解器創新的多重物理耦合技術,為您剖析 Celsius熱解算器如何通過整個系統模擬精確的溫度分布,幫助您分析並解決問題,進而實現從早期設計到signoff的完整分析!

日期: 2021年6月9日 (三)
時間: 14:00 pm-15:00 pm (台北時間)

立即報名✍️✍️https://events.cadence.com/event/fc2acba5-8844-4df1-aa10-8019b1d66d52/summary


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Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available at www.cadence.com.
益華電腦科技(Cadence Design Systems, Inc.) -全球總部網址:https://www.cadence.com -台灣網址:https://www.cadence.com/tw
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